Substrate Agnostic.
Performance Driven.
The Future of Electrochemical
Deposition: Engineered for
Precision.
Developing a new technology often demands a series of compromises. Until now, electroplating forced a choice: you could have superior co-planarity, low cost, material flexibility, or scalability—but never all at once.
That era is over.
Wafer-Level
Electroplating
In the realm of advanced logic and heterogeneous integration, Dynamic Drop™ delivers the industry’s most elusive combination: ultra-tight co-planarity and accelerated deposition rates. While co-planarity is the lifeblood of high-density interconnects—essential for AI accelerators and High Bandwidth Memory (HBM)—the industry has long been throttled by sluggish deposition speeds.
RiseTech shatters this bottleneck. Our technology ensures that the same precision and throughput define the next generation of power and automotive components, as well as the signal integrity required for mission-critical sensors and communications devices.
Panel-Level
Scalability
Panel-level packaging is expected to offer cost advantages, which will open the Heterogeneous Integration doors to new applications such as power and automotive or sensors and communications.
However, industry is lacking a standardized panel size, and this is slowing adoption and limiting scalability. Thanks to its modular architecture, Dynamic Drop™ is easily scalable to any substrate form factor without impact on co-planarity or deposition rate.
Advanced Metal
Alloys
Using Advanced Metal Alloys like SAC (Sn-Ag-Cu) offers specific benefits. over conventional SnAg: superior thermal fatigue resistance for the extreme reliability required in Power and Automotive; low melting points that enable the ultra-fine-pitch bonding essential for advanced packaging and Heterogeneous Integration; exceptional solderability and mechanical strength for next-gen Sensors and Communication devices.
Dynamic Drop™ is the sole technology that allows advanced alloys to be electroplated – enabling tight definition and high process control.
