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Dynamic Drop™: precision at scale,
innovation at speed.

The next era of heterogeneous integration demands more than just standard deposition; it requires total control. Dynamic Drop™ is RiseTech’s proprietary technology, engineered to redefine the benchmarks of electrochemical deposition (ECD) through unparalleled droplet precision and speed. By mastering the fluid dynamics of electroplating, we enable high-yield results where traditional methods fail, bridging the gap between complex R&D designs and high-volume manufacturing (HVM).

Beyond traditional bath deposition: a new category of performance.

Best quality, unprecedented capability

Our technology provides localized control of chemical flow, enabling superior co-planarity and the electrochemical deposition (ECD) of complex multi-material alloys. This precision ensures that even the most intricate heterogeneous integration designs achieve maximum yield and performance.

Unrivaled Deposition Speed

Experience a deposition rate up to 5x faster than conventional bath deposition. By leveraging high-speed liquid flow, Dynamic Drop™ delivers The Speed of Precision, drastically reducing cycle times without compromising the structural integrity of the semiconductor layers.

Seamless Scalability

Rapid scaling across different form factors, optimum results on any pattern including highly non-uniform

Beyond the Bath:
How Dynamic Drop™
works

Beyond the bath. Dynamic Drop™replaces rigid, slow processes with a localized, high-speed flow system that scales seamlessly across any form factor. Traditional electrochemical deposition relies on stagnant immersion, limiting both speed and control.

Transform complex deposition
challenges into high-yield reality at
The Speed of Precision.

Challenge our Technology

The new Benchmark
for Electrodeposition

RiseTech’s proprietary Dynamic Drop technology reinvents the process through a localized, high speed fluidic cycle.

By confining the electrochemical reaction within a controlled droplet, we eliminate substrate waste, delivering up to 5x faster deposition with surgical precision.