High-Rate Deposition. Nanometer
Control. Zero Compromise.
Leading the Next Era of
Semiconductor Integration.
RiseTech delivers electrochemical deposition (ECD) excellence engineered for the uncompromising demands of heterogeneous integration and AI, Automotive and power, and sensors and communications semiconductors. By optimizing both throughput and deposition precision, we empower manufacturers to lead the chiplet revolution.
RiseTech’s innovative heterogeneous integration solutions provide the thermal stability and interconnect density required for next generation of high-performance computing, electrified mobility, healthcare, and beyond.
Where conventional methods stall, RiseTech accelerates.
Advanced Logic and AI
Heterogeneous integration relies on precision wafer-level and panel-level electroplating to create micro-bumps that bridge logic and AI chips. While high deposition rates ensure manufacturing throughput, accurate co-planarity prevents connection failures across thousands of joints. This uniformity is vital for stable high-speed data transfer, and the structural integrity of dense 3D stacks and Dynamic Drop™ achieves it like no other technology on the market.
Power & Automotive
Electroplating is the cornerstone of robust power distribution and thermal management in automotive and power applications.
Dynamic Drop™ helps wafer-level electroplating where it enables precise, miniature interconnects, panel-level electroplating by scaling production for cost-effective, large-format circuitry, and allows using advanced metal alloys such as SAC —delivering the high-temperature reliability and mechanical durability essential for harsh automotive environments and long-term power semiconductor.
Heterogeneous
Integration
Chiplet disaggregation relies on precision electroplating to forge dense interconnects that link functional blocks. wafer-level electroplating produces the ultra-fine micro-bumps essential for logic, while panel-level electroplating provides high-volume scaling for larger substrates.
By utilizing advanced metal alloys like SAC, RiseTEch ensures these modular connections withstand the thermal stresses of high-performance AI computing, providing the structural integrity that the chiplet revolution demands.
Sensors &
Communications
In the specialized domain of Sensors & Communications, MEMS, RF, Optical Systems, and legacy logic—versatility and flexibility are the #1 priority.
Dynamic Drop™ delivers unprecedented scalability and material flexibility (such as SAC and advanced alloys); high process control at wafer-level (enabling precise MEMS and RF miniaturization); scalability to large panel. This adaptability ensures high-performance connectivity and signal integrity across complex, multi-functional communication device architectures.
