enit
Contact us

Dynamic Drop™: precision at scale,
innovation at speed.

The next era of heterogeneous integration demands more than just standard deposition; it requires total control. Dynamic Drop™ is RiseTech’s proprietary technology, engineered to redefine the benchmarks of electrochemical deposition (ECD) through unparalleled droplet precision and speed. By mastering the fluid dynamics of electroplating, we enable high-yield results where traditional methods fail, bridging the gap between complex R&D designs and high-volume manufacturing (HVM).

Beyond traditional bath deposition: a new category of performance.

Best quality, unprecedented capability

Our technology provides localized control of chemical flow, enabling superior co-planarity and the electrochemical deposition (ECD) of complex multi-material alloys. This precision ensures that even the most intricate heterogeneous integration designs achieve maximum yield and performance.

Unrivaled Deposition Speed

Experience a deposition rate up to 10x faster than conventional bath deposition. By leveraging high-speed liquid flow, Dynamic Drop™ delivers The Speed of Precision, drastically reducing cycle times without compromising the structural integrity of the semiconductor layers.

Seamless Scalability and Process Control

Transition from R&D to high-volume manufacturing (HVM) with ease. Our systems offer rapid scaling across different form factors, supported by an accurate, closed-loop process control system that guarantees consistency and reliability at every stage of production.

Beyond the Bath:
How Dynamic Drop™
works

Beyond the bath. Dynamic Drop™replaces rigid, slow processes with a localized, high-speed flow system that scales seamlessly across any form factor. Traditional electrochemical deposition relies on stagnant immersion, limiting both speed and control.

Transform complex deposition
challenges into high-yield reality at
The Speed of Precision.

Challenge our Technology

The new Benchmark
for Electrodeposition

RiseTech’s proprietary Dynamic Drop technology reinvents the process through a localized, high speed fluidic cycle.

By confining the electrochemical reaction within a controlled droplet, we eliminate substrate waste, delivering up to 10x faster deposition with surgical precision.