The company is under development in the semiconductor field, focusing on the Wafer Level Chip Scale Packaging (WLCSP) market using Copper Pillar, Solder Bumps (µBGA), and Wafer Level Packaging forming re-routing (RDL) structures in both silicon and glass.
The WLCSP market size grew from $1.98 billion in 2022 to $2.21 billion in 2023 with a compound annual growth rate (CAGR) of 11.3%. The WLCSP market size is projected to grow to $3.32 billion by 2027 with a CAGR of 10.7%.
The company exploits the exclusivity of its patented and unique technology to manufacture multilayer materials in both the field of multiphase solder alloys and the field of micro-electromechanical systems and their packaging.
The figures show examples of structures such as Copper Pillar, micro-Ball Gate Array of three-component solder alloy (Tin/Silver/Copper – 96.5% Sn, 3%Ag, 0.5%Cu) for chemical electroplating and RDL for WLCSP.
